Embedded Technologies, Inc.

AMOS-5000

Description

The VIA AMOS-5000 modular chassis kit is designed to take advantage of boards based on the VIA-developed Em-ITX form factor, making it easy to create a range of highly versatile, fanless, rugged and easy to assemble IPC design for a range of embedded applications.

The VIA AMOS-5000 chassis kit takes advantage of the unique features that Em-ITX brings to the embedded market, including a rich I/O feature set along both sides of the board through unique dual I/O coastlines, an EMIO bus which uses both legacy and modern bus technologies to work with a range of Em-ITX expansion modules in a variety of application specific I/O configurations.

Systems built using the VIA AMOS-5000 chassis kit are completely fanless and withstand a wide temperature range of -20°c to 55°c. Capable of sustaining a g-force of up to 50, VIA AMOS-5000 chassis are easily assembled and maintained, using only five mechanical pieces to form a robust, fanless system with extensive I/O options.

Product Specifications

Key Features include:

  • Fanless operation from -20°C up to 55°C
  • Easy, quick installation and maintenance with only five parts
  • Shock resistant up to 50G with vibration resistant design to ensure extended reliability
  • Modularized design with compact dimensions: 232mm(W) x 53mm(H) x 126mm(D)
  • Easy to use inter-changeable and customizable front and rear panels
  • Built-in common I/O functional feature cutouts for easy external access
  • Maximum space efficiency for optimized electromagnetic compatibility

The VIA AMOS-5000 is currently paired with the VIA EITX-3000 board, the first Em-ITX board on the market, targeting a wide variety of embedded segments including medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications.


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